Selection of Particle Size of Micro Silicon Powder in Copper Clad Laminate

In theory, the smaller the particle size of silica, the more favorable it is for the filling system to bond. However, in the actual process of mixing and gluing in the production of copper-clad panels, the finer the silica, the easier it is to agglomerate and not easily disperse, and the filler is unevenly dispersed in fiberglass. Therefore, it is necessary to increase the amount of solvent used; But if the particle size is too large, sedimentation is prone to occur during the mixing and gluing process, and the impregnation of fiberglass during gluing decreases. Due to the filtering effect of fiberglass paper, the distribution of fillers in the fiberglass paper will also be uneven. So from a process perspective, choosing a reasonable particle size range is a very important parameter.

Silicon dioxide suppliers generally recommend the use of silica with an average particle size of 1.5um-3um to users.